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Browsing > By author > Mercier Sébastien
Modelling of elastic-viscoplastic composites by the additive Mori-Tanaka scheme based on a modified tangent linearization sciencesconf.org:esmc2025:597044 |
Microvia homogenised behavior for the mechanical modelling of PCB with embedded components sciencesconf.org:esmc2025:603224 |
Computation of residual stress development in boron steels and experimental assessment with X-ray and neutron diffraction. sciencesconf.org:esmc2025:597703 |
Experimental characterization and numerical simulations of fracture of interfaces in mode I and II for printed circuit boards application sciencesconf.org:esmc2025:592428 |
Effect of the viscoelastic behavior of the composite substrates on the thermomechanical modeling of a printed circuit board sciencesconf.org:esmc2025:597577 |
Analytical and Numerical Analysis of Necking in Dynamic Expansion of Thin Structures sciencesconf.org:esmc2025:591880 |
Identification method of the resin shrinkage: Application to woven composite used in Power Electronics sciencesconf.org:esmc2025:591914 |
Numerical study of a printed circuit board with embedded components under thermal cycling: influence of the manufacturing process sciencesconf.org:esmc2025:592394 |
